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The effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding
  • ISSN号：0946-7076
  • 期刊名称：Microsystem Technologies
  • 时间：2012.6.6
  • 页码：815-822
  • 相关项目：活化与细密的微电铸层界面结合理论与控制方法
作者： Du, Liqun|Chang, Hongling|Song, Mancang|Liu, Chong|
同期刊论文项目
活化与细密的微电铸层界面结合理论与控制方法
期刊论文 16 会议论文 5 专利 3
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