阻断能力是绝缘栅双极型晶体管(IGBT)的一个重要参数指标,阻断能力的好坏直接影响器件的整体特性。以平面穿通型IGBT为例,对IGBT的场限环终端结构进行了理论分析,通过器件模拟软件对IGBT的阻断特性进行了模拟,并优化了IGBT场限环的宽度、间距及数目,提高了IGBT的阻断能力,为IGBT的设计提供了参考。最终优化的结果,在场限环宽度分别为24μm,21μm,18μm,15μm,场限环间距为3μm,4μm,5μm,6μm,场限环数目为4个时,得到的阻断电压达到1240V。
Blocking ability is an important parameter of insulated gate bipolar transistor(IGBT), which directly affects the overall characteristics of IGBT.The structure with field limiting rings is analyzed for planar punch through IGBT, the blocking capability of IGBT is simulated with the device simulation software, the width, spacing and number of IGBT field limiting rings are respectively optimized, the blocking capability of IGBT is improved, that provides a reference for the design of IGBT.The final optimization results is that,when the width of IGBT field limiting rings are 24 μm, 21 μm, 18 μm, 15 μm,the spacing between IGBT field limiting rings are 3 μm,4 μm,5 μm,6 μm,the number of IGBT field limiting rings are 4, the blocking voltage is able to reach 1 240 V.