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Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During The
  • 期刊名称：IEEE Transation on Components, Packaging and Manuf
  • 时间：0
  • 页码：521-526
  • 相关项目：芯片铜线键合界面微结构生成机理与规律研究
作者： Li Junhui| Zhang Xiaolong| Liu Linggang| Deng L|
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芯片铜线键合界面微结构生成机理与规律研究
期刊论文 9 会议论文 2 专利 5
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