位置：成果数据库 > 期刊 > 期刊详情页
HRTEM And X-Ray Diffraction Anylsis Of Au Wire Bonding Interface In Microelectronics Packaging
  • 期刊名称：Solid State Sciences(IF2011=1.856)
  • 时间：0
  • 页码：72-76
  • 相关项目：芯片铜线键合界面微结构生成机理与规律研究
作者： Li Jun-Hui| Wang Ruishan| Han Lei| Wang Fuliang|
同期刊论文项目
芯片铜线键合界面微结构生成机理与规律研究
期刊论文 9 会议论文 2 专利 5
同项目期刊论文
Microwave-assisted synthesis and characterization of hexagonal Fe3O4 nanoplates
Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During The
Research of Multi-Axes Motion Control System Based On LabVIEW Platform
Study on A Cooling System Based on Thermoelectric Cooler for Thermal Management of High-power LEDs
Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding
Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics pa
A Cooling System with a Fan for Thermal Management of High-Power LEDs
Design of Data Acquisition System Based on LabVIEW