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Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics pa
  • 期刊名称：Microelectronics Reliability (IF2011=1.167)
  • 时间：0
  • 页码：2236-2242
  • 相关项目：芯片铜线键合界面微结构生成机理与规律研究
作者： Li Junhui| Deng Luhua| Ma Bangke| and Han Lei|
同期刊论文项目
芯片铜线键合界面微结构生成机理与规律研究
期刊论文 9 会议论文 2 专利 5
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