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Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding
  • ISSN号：0741-3106
  • 期刊名称：IEEE Electron Device Letters(IF2011=2.849)
  • 时间：0
  • 页码：1433-1435
  • 相关项目：芯片铜线键合界面微结构生成机理与规律研究
作者： Li Junhui|Liu Linggang|Deng Luhua|Ma Bangke|Wang Fuliang|Han Lei|
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芯片铜线键合界面微结构生成机理与规律研究
期刊论文 9 会议论文 2 专利 5
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