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Evaluation of thermal fatigue damage of 200 nm-thick Au interconnect lines
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  • 相关项目：纳米金属多层薄膜疲劳行为及其界面效应的研究
同期刊论文项目
纳米金属多层薄膜疲劳行为及其界面效应的研究
期刊论文 23 会议论文 5 著作 1
同项目期刊论文
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Effects of interface and grain boundary on the electrical resistivity of Cu/Ta multilayers.
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Interface instability within shear bands in nanoscale Au/Cu multilayers
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几种金属多层薄膜的形变与断裂行为及其机制