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Tensile and fatigue strength of ultrathin copper films
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  • 相关项目：纳米金属多层薄膜疲劳行为及其界面效应的研究
同期刊论文项目
纳米金属多层薄膜疲劳行为及其界面效应的研究
期刊论文 23 会议论文 5 著作 1
同项目期刊论文
Effects of Interface and Grain Boundary on the Electrical Resistivity of Cu/Ta Multilayers
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Strength and Plastic Deformation Behavior of Nano-Scale Au-Cu and Cr-Cu Multilayers
Electric Current-induced Failure of 200-nm-thick Gold Interconnects
Effects of interface and grain boundary on the electrical resistivity of Cu/Ta multilayers.
Direct observation of dislocation plasticity in 100 nm scale Au/Cu multilayers
On interface strengthening ability in metallic multilayers
Damage behaviors of Cu/Ta bilayered films under cyclic loading
Fatigue properties of nanometer-scale copper films
Experimental evidence of plastic deformation instability in nanoscale Au/Cu multilayers
几种单晶半导体材料在压痕下的变形与断裂的对比研究
Interface instability within shear bands in nanoscale Au/Cu multilayers
Fatigue and Thermal Fatigue Damage Analysis of Thin Metal Films
Origin of cracking in nanoscale Cu/Ta multilayers
Evaluation of crack-initiation strain of Cu-Ni multilayer on a flexible substrate
Two different types of shear deformation behaviour in Au/Cu multilayers
Comparative investigation of strength and plastic instability in Cu/Au and Cu/Cr multilayers by inde
Tensile and fatigue properties of ultrafine-scale Cu-Ni multilayers
Evaluation of thermal fatigue damage of 200 nm-thick Au interconnect lines
Suppression of premature fracture of silicon: Role of nanoscale localized deformation of metallic mu
几种金属多层薄膜的形变与断裂行为及其机制