中文摘要：

采用直流脉冲磁控溅射法制备铜膜,利用X射线衍射法分析薄膜相结构,通过扫描电镜观察薄膜形貌,基于纳米压痕载荷-位移曲线计算薄膜的硬度、弹性模量和接触刚度,同时采用显微硬度法测量薄膜硬度,系统研究了溅射功率和偏压对铜膜结构和力学性能的影响。结果表明,通过纳米压痕载荷-位移曲线计算薄膜力学性能是可靠的。随着溅射功率的增大,铜膜生长取向几乎无变化,均呈无择优生长状态,弹性模量、接触刚度基本不变,硬度略有减小;偏压增大会使铜膜呈现明显的（111）取向生长,接触刚度、弹性模量和硬度呈下降趋势。

英文摘要：

Copper films were prepared by DC pulsed magnetron sputtering. The film phase structure was analyzed using X-ray diffraction and the film morphology was observed by scanning electron microscopy. The hardness, elastic modulus, and contact stiffness of Cu films were calculated based on nanoindentation load-displacement curve. The film hardness was also tested by mierohardness tester. Thus, effects of sputtering power and bias on the structure and mechanical properties of copper films were investigated systematically. The results show that the mechanical property calculation of thin films through the nanoindentation load displacement curves is reliable. With the increase of sputtering power the copper film always presents no preferential growth, and the elastic modulus and contact stiffness are almost unchanged, but the hardness decreases slightly. However, the copper film presents obvious preferred orientation of （111） with increasing bias, and all of the contact stiffness, elastic modulus and hardness decrease.