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中文摘要：
随着太阳能技术和半导体技术的飞速发展,对硅片的直径,厚度和精度提出了更高的要求,传统的硅片加工方式已经不能满足需要。文章分析内圆切割、多线切割、电火花钱切割和超声振动切割四种硅片切割方式,指出多线切割是硅片的主要切割方式,电火花线切割硅片技术有很大的发展潜力,超声振动切割优于其它三种硅片切割方式。
英文摘要：
With the rapid development of solar energy technology and semiconductor technology,the traditional silicon processing methods can＇t meet the requirements in diameter,thickness and precision of silicon wafer.This paper discusses the characteristics and common methods of cutting silicon wafer including inner circle cutting,multi-wire cutting,electrical discharge machining and ultrasonic vibration cutting.It points out that the main way for cutting silicon wafer is multi-wire cutting,the electrical discharge machining has great potential to development,the ultrasonic vibration cutting is better than the other three silicon wafer cutting methods.
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