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Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices
  • ISSN号：0895-2477
  • 期刊名称：Microwave and Optical Technology Letters
  • 时间：0
  • 页码：76-79
  • 语言：英文
  • 相关项目：半导体光电子器件高频特性的基础研究
作者： Zhang, S.J.|Zhu, N.H.|Wen, J.M.|Liu, Y.|
同期刊论文项目
半导体光电子器件高频特性的基础研究
期刊论文 93 会议论文 7 专利 22 著作 3
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