中文摘要：

提出了一种新型多晶硅薄膜热膨胀系数的电测试结构,给出了热机电耦合模型和测试方法,并利用Coventor软件和ANSYS软件进行模拟和验证.分析表明模拟结果和理论结果基本一致,从而验证了该模型.该方法能够实现多晶硅薄膜热膨胀系数的在线提取,测量方便,独立性较高,以电学量形式输出,对于薄膜热膨胀系数的在线检测有一定参考价值.

英文摘要：

A novel method for electrically measuring the thermal expansion coefficient of polysilicon thin films is presented. A thermal-electro-mechanical compliant model of the polysilicon thin film is established. Finite element software Coventor and ANSYS are used to verify this method. This method is convenient,and its output is in the form of an electrical signal. Thus,it is valuable for insitu measuring the thermal expansion coefficient of polysilicon thin films.