针对微晶玻璃超精密磨削加工不可避免的表面/亚表面损伤问题,通过微晶玻璃磨削试验研究500、1500、2000和5000金刚石砂轮磨削微晶玻璃的表面形貌、表面/亚表面损伤特征及其材料去除机理,揭示微晶玻璃脆性域磨削和塑性域磨削的表面/亚表面损伤特征,提出依次采用500金刚石砂轮粗磨和5000金刚石砂轮精磨的微晶玻璃高效低损伤磨削工艺。结果表明,500和1500金刚石砂轮磨削表面的材料去除方式为脆性断裂去除,2000金刚石砂轮磨削表面的材料去除方式同时包括脆性断裂去除和塑性流动去除,5000金刚石砂轮磨削表面的材料去除方式为塑性流动去除;脆性域磨削微晶玻璃的表面损伤形式为凹坑、微裂纹、深划痕,亚表面损伤形式为微裂纹;塑性域磨削微晶玻璃的表面损伤形式为微磨痕,亚表面损伤形式为靠近磨削表面的材料的塑性流动。
The surface/subsurface damage is generated inevitably in grinding glass-ceramics. In this study, the surface topography, surface/subsurface damage characteristics and material removal mechanism of glass-ceramics ground by diamond wheels with different abrasive sizes of 500, 1 500, 2 000 and 5 000 are investigated. The surface/subsurface damage characteristics of glass-ceramics in brittle-mode grinding and ductile-mode grinding respectively are revealed, and a high-efficiency and low-damage ultra-precision grinding process of glass-ceramics by stages using 500 diamond wheel for rough grinding and 5 000 diamond wheel for fine grinding is proposed. The experiment results show that the material is removed in brittle mode when glass-ceramics are ground by 500 and 1 500 diamond wheels, in both brittle mode and ductile mode when ground by 2 000 diamond wheel, and in ductile mode when ground by 5 000 diamond wheel. In the brittle-mode grinding of glass-ceramics, the surface damage consists of pits, microcracks and deep scratches, and the subsurface damage takes the form of microcracks. But in the ductile mode grinding of glass-ceramics, the surface damage has only micro-scratches, and subsurface damage is the plastic flow of workpiece material closed to the ground surface.