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A finite difference scheme for 3D semiconductor device of heat conduction on composite triangular gr
  • 期刊名称：Far East Journal of Mathematical Sciences
  • 时间：2012
  • 页码：207-218
  • 相关项目：基于利率和死亡率建模的寿险风险分析
作者： Liu，Wei|
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基于利率和死亡率建模的寿险风险分析
期刊论文 21 会议论文 4 获奖 4
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