中文摘要：

介绍了喷射电铸的相关原理,运用扫描电镜分析了相关工艺参数（电流密度、电解液喷射速度、扫描速度、扫描层数）对铜沉积层微观结构的影响,采用工艺参数：电流密度300A/dm^2,电解液喷射速度4m/s,喷嘴扫描速度10mm/s制备了纳米铜块体。结果表明喷射电铸可大大提高电铸的电流密度,远高于传统电铸电流密度;电流密度、喷射速度、扫描速度以及扫描层数都对沉积层的表面生长形态有较大的影响,使用低电流密度、高喷射速度和快的扫描速度和少的扫描层数有利于获得平整、致密的沉积层。

英文摘要：

Related principles of jet electroforming were introduced,which was used to prepare bulk copper.The influences of the main experimental parameters,such as current density,electrolyte jet velocity,scanning velocity and scanning number,on the microstructure of copper electrodeposition layer were studies using scanning electron microscopy.Nanocrystalline bulk copper was fabricated using the optimum processing parameters with current density of 300A/dm2,jet velocity of 4m/s and scanning velocity of 10mm/s.The results show that the current density used in jet electroforming is greatly higher than that in traditional electroforming.Current density,electrolyte jet velocity,scanning velocity and scanning number have great effects on the surface morphology of the deposited copper.The copper deposition with fine grains and flat surface can be got by using lower current density,high jet flow and rapid scanning speed.