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中文摘要：
以电阻率法探索了Sn-Ag（Cu）系无铅焊料诸多合金熔体的电阻率-温度行为及变化规律.结果表明,该系合金熔体电阻率随温度在某些温度区域发生异常变化,提示熔体结构状态发生改变.此外,Cu及Ag成分的微量改变,既影响异常区的温度范围,又影响电阻率-温度行为特征.还从化学短程序消散及重组的角度分析了有关异常行为.
英文摘要：
Temperature dependence of electrical resistivities of liquid Sn-Ag（Cu） lead-free alloys with different components was explored by conducting resistivity experiments.Anomalous changes in some temperature intervals indicated the existence of liquid structural transformation in the melt above liquidus.In addition,for the anomalous transitions,the temperature ranges and the changing characteristics vary with different contents of Cu and Ag in Sn-Ag-Cu ternary melts.The electronic resistivity-temperature anomalous behaviors are also analyzed from the viewpoint of chemical short range order＇s dissipation and rebuilding.
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