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Sn-Sb15无铅焊料熔体结构转变及其对凝固和润湿性的影响
  • ISSN号：1005-8192
  • 期刊名称：《金属功能材料》
  • 时间：0
  • 分类：TG146.1[金属学及工艺—金属材料;一般工业技术—材料科学与工程;金属学及工艺—金属学]
  • 作者机构：[1]合肥工业大学材料科学与工程学院,安徽合肥230009
  • 相关基金：国家自然科学基金资助项目（50571033）;安徽省自然科学基金（070416234）
作者： 董野峰[1], 李先芬[1], 祖方遒[1], 刘兰俊[1], 赵雪梅[1]
关键词： Sn-Sb无铅焊料, 电阻率, 润湿性, 凝固, Sn-Sb lead-free solder, resistivity, wettability, solidification
中文摘要：

在高达1 200℃的范围内,通过直流四电极法研究了Sn-Sb15无铅焊料合金在液相线以上一定温度范围内发生熔体结构转变的可能性及规律,并以此为切入点研究了熔体结构转变前后焊料的凝固组织和润湿性能的变化规律。研究表明：Sn-Sb15合金熔体发生了温度诱导的液态结构转变;这种转变细化了凝固组织、改善了Sn-Sb合金钎料的润湿性能。

英文摘要：

The possibility and rule of liquid structure transition of Sn-Sbl5 lead-free solder were studyed by DC four - electrode method within liquidus to 1200 ℃. The variation of solidification structure and wetting properties of the solder were studied. The results showed that temperature-induced liquid structural of the molten Sn-Sbl5 alloy were changed. The refinement of solidification structure and improvement of wettability of Sn-Sb filler metal were produced by these changes.

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基于液液结构转变探索合金熔体结构对凝固组织生长行为作用
期刊论文 43 会议论文 4 获奖 1
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期刊信息
  • 《金属功能材料》
  • 中国科技核心期刊
  • 主管单位:中国钢铁工业协会
  • 主办单位:中国钢研科技集团有限公司
  • 主编：赵栋梁
  • 地址：北京海淀区学院南路76号
  • 邮编：100081
  • 邮箱：MFM@chinamet.cn
  • 电话：010-62182270
  • 国际标准刊号：ISSN：1005-8192
  • 国内统一刊号：ISSN：11-3521/TG
  • 邮发代号:18-244
  • 获奖情况:
  • 中国科技论文统计源期刊,中国科技期刊综合评价数据库来源期刊,中国科学引文数据统计源期刊
  • 国内外数据库收录:
  • 美国化学文摘（网络版）,中国中国科技核心期刊
  • 被引量:3505