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芯片强化散热研究新领域——低熔点液体金属散热技术的提出与发展
  • 期刊名称:电子机械工程,vol.26, pp.9-12, 25, 2006
  • 时间:0
  • 分类:TN03[电子电信—物理电子学]
  • 作者机构:[1]低温工程学重点实验室,中国科学院理化技术研究所,北京100190
  • 相关基金:国家自然科学基金项目(50576103)
  • 相关项目:基于低熔点金属及其合金的计算机芯片散热技术研究
中文摘要:

针对高热流密度器件引发的热障问题,电磁驱动型室温金属流体散热方法正显示出重要的应用前景。作为该类系统的动力源,电磁泵直接影响着最终散热性能。为深入认识电磁泵驱动室温金属流体的特性,建立了相应的磁流体动力学方程,针对两类不同流道结构的电磁泵,采用有限元方法模拟得到了金属流体在电磁泵内的流速分布、电流分布以及进出口压差。同时,采用浇注方法制作了透明的室温金属流体电磁泵,开展了初步的静压测试,验证了计算方法和仿真程序的准确性;结果表明,室温金属流体电磁泵的进出口压差与磁感应强度和输入的电极电流成线性关系。此项研究为室温金属流体电磁泵的设计和优化研究打下了基础。

英文摘要:

With the rapid development of high heat flux density computer chip,tremendous heat generation in the chip has become a major concern for the thermal management.Electromagnetically pumped liquid metal for chip cooling method shows significant potential in this area.As the driving force source of the liquid metal,electromagnetic pump determines the final efficiency of the liquid metal cooling system.To get a thorough understanding of the behaviors of liquid metal fluid inside electromagnetic pump,a mathematical model for liquid metal in the channel of the pump is established.Two different structures of electromagnetic pump were analysed and compared.Via FEM method,the flow and current distributions in the electromagnetic pump were simulated,and the pressure head between inlet and oulet was obtained.Furthermore,by way of a pouring method,an transparent electromagnetic pump was manufactued and static pressure tests were conducted.Through comparison with the experimental data,the numerical predictions were validated.The results indicate that the pressure head between inlet and oulet takes a linear relation with the magnetic induction intensity and electrode current.This work laid a foundation for design and further study of liquid metal electromagnetic pump.

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