中文摘要：

针对红外线线列电荷耦合元件（Charge-coupled device,CCD）机械交错拼接中过于依赖拼接装置精度和拼接效率低的问题,提出一种基于装配精度预分析的红外线CCD实时装调方法.该方法在实时获取已装配芯片测量信息的基础上,根据CCD空间位置要求构建CCD整体装配精度模型,采用蚁群算法进行装配精度优化,确定待装配芯片坐标信息,并获得调整工装的调整量指导现场装配,从而有效实现了拼接过程的实时监视和快速调正.采用该方法后一个线列CCD的装调时间可控制在3天内,与传统方法相比装配效率显著提高,同时搭接误差不大于6μm,直线度不大于8μm,平行度不大于10μm,满足了工程要求.

英文摘要：

Aiming at the overly dependent on the splicing apparatus precision and low efficiency of splicing of infrared linear charge-coupled device（CCD）.A real-time alignment of infrared CCD based on the assembly precision is proposed.The spatial position of the assembled chip is got in real time.The overall assembly precision model of CCD will be constructed according to the requirements of the CCD spatial position.then the chip coordinate information which will be fitted is determine through the ant colony algorithm,guide the actual assembly and adjust tooling adjustments.It is effectively to achieve real-time monitoring and rapid alignment of the splicing process.Through the experiments of the prototype system alignment,the time of CCD alignment can be controlled in 3 days,have remarkable increase efficiency compared with traditional methods,while lap error is no more than 6 μm,straightness is no more than 8 μm,parallelism is no more than 10 μm,meeting the project requirements.