采用射频磁控溅射技术,以LaNiO3(LNO)作为过渡层,在SiO2/Si(100)、Pt(111)/Ti/SiO2/Si(100)衬底上分别获得了(100)、(110)取向的(Pb0.90La0.10)Ti0.975O3(PLT)铁电薄膜。研究了LNO/Pt(111)/Ti/SiO2/Si(100)和LNO/SiO2/Si(100)基底对PLT薄膜微结构和铁电性能的影响。实验结果表明,与在LNO/Pt(111)/Ti/SiO2/Si(100)基底上沉积的(110)取向的PLT薄膜相比较,在LNO/SiO2/Si(100)基底上沉积的高度(100)取向的PLT薄膜具有更好的微结构和更高的剩余极化强度,其2Pr为40.4μC/cm^2。
The (100)-and (110)-oriented (Pb0.90 La0.10)Ti0.975O3[PLT] thin films were prepared on the SiO2/Si (100) and Pt(111)/Ti/SiO2/Si(100) substrates by RF magnetron sputtering with a LaNiO3 [LNO] buffer layer, respectively. The effect of LNO/Pt(111)/Ti/SiO2/Si(100) and LNO/SiO2/Si(100) substrates on the microstructure and ferroelectric properties of PLT thin films was investigated. The experimental results in this work indicate that the (100)-orientated (Pb0.90 La0.10)Ti0.975O3 thin film deposited on the LNO/SiO2/Si(100) substrate possesses better microstructure and ferroelectric properties with larger remnant polarization (2Pr= 40.4μC/cm^2), as compared with (110)-oriented one (2Pr=22.4μC/cm^2) deposited on the LNO/Pt(111)/Ti/ SiO2/Si(100) substrate.