中文摘要：

目的：用温度循环的方法评价老化对一步法和两步法自酸蚀粘接剂与牙本质粘接耐久性的影响。方法：选择人离体磨牙42颗，制备浅层牙本质平面，随机分为6组，分别使用3种自酸蚀粘接剂：两步法粘接剂ClearfilSEbond（SE），一步法粘接剂AdperPrompt（AP）和G-bond（GB），用复合树脂形成树脂冠。沿长轴纵向切割成1．0mm×1．0mm的条状，在粘接后24h、温度循环（5℃～55℃）5000次后测试微拉伸粘接强度及进行硝酸铵银渗漏实验观察界面纳米渗漏情况。粘接强度值采用单因素方差分析进行统计分析，界面渗漏情况在扫描电镜背散射模式下进行观察。结果：3种粘接剂微拉伸粘接强度分别为：SE粘接即刻（40．60±5．76）MPa，温度循环后（45．80±2．97）MPa；AP粘接即刻（19．06±1．50）MPa，温度循环后（12．62±2．10）MPa；GB粘接即刻（17．75±1．10）MPa，温度循环后（6．24±0．42）MPa。单因素方差分析显示粘接剂种类与温度循环对粘接强度均有显著影响（P〈0．05），二者之间存在交互作用。温度循环后，AP与GB强度显著下降（P〈0．05），SE略有升高。3种粘接剂相比，即刻及温度循环处理后SE粘接强度显著高于AP、GB组（P〈0．05）。纳米渗漏结果显示一步法自酸蚀粘接剂界面渗漏比两步法更为显著。结论：温度循环实验可导致自酸蚀粘接剂界面的变化，表现为界面形态与粘接强度的变化。一步法自酸蚀粘接剂耐久性弱于两步法自酸蚀粘接剂。

英文摘要：

Objective：To investigate influence of thermalcycling on the bonding durability of two onestep products [ Adper Prompt （AP） and G-bond （GB） ] and one two-step self-etching adhesive [ Clearfil SE bond （SE） ] with dentin in vitro. Methods： Forty-two extracted human molars were selected. The superficial dentin was exposed by grinding off the enamel. The teeth were randomly distributed into six groups with varied bonding protocols. The adhesives were applied to the dentin surface. Composite crowns were built up, then the samples were cut longitudinally into sticks with 1.0 mm× 1.0 mm bonding area [ for microtensile bond strength （MTBS） testing] or 1.0 mm thick slabs （for nanoleakage observation）. Bondinz performance was evaluated with or without thermalcvling. For the MTBS testing, the strength values were statistically analysed using One-Way ANOVA. Four slabs in each group were ob- served for nanoleakage by SEM with a backscattered electron detector. Results：Thermalcycling procedures affected MTBS. In the two one-step groups, the MTBS decreased significantly （P 〈 O. 05 ） after thermalcycling [AP group from （ 19.06 ± 1.50） MPa to （ 12.62 ± 2.10） MPa; GB group from （ 17.75 ± 1.10） MPa to （6.24 ± 0.42 ） MPa ]. But in SE groups, MTBS did not significantly affect [ （45.80 ± 2.97 ） MPa compared with （40.60 ± 5.76 ） MPa ]. As a whole, one-step self-etching adhesives showed lower MTBS than two-step bonding system after aging. For AP and GB, continuous nanoleakage notable and more obvious than for SE. Conelusion：Thermalcycling can affect the bonding self-etch adhesives including decrease of bond strength and nanoleakage pattern. One-step appearance was performance of self-etch adhesives showed more obvious change compared with their two-step counterparts.