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中文摘要：
使用有限元法模拟了具有加工硬化的薄膜/基底体系在Berkovich压痕下的力学响应,讨论了薄膜与基底屈服强度比、薄膜/基底的加工硬化和压头尖端半径对临界压痕极限的影响.研究发现：薄膜的加工硬化使临界压痕极限减少,而基底加工硬化没有产生明显的影响;同时,随着压头尖端半径的增大,临界压痕深度减少.
英文摘要：
A finite element analysis was carried out to simulate the nano-indentation on a film/substrate material system with work hardening.The influence of the film-to-substrate yield-strength ratio,the work hardening of the film/substrate system and the indenter tip radius on the critical indentation limit have been analyzed.The work hardening of the film decreases the critical limit whilst that of substrate does not show any appreciable influence.The critical indentation depth decreases with increasing indenter-tip radius.
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