中文摘要：

利用有限元软件ANSYS对MEMS微电铸Ni工艺进行电场模拟，研究了光刻胶厚度、线宽以及片内辅助电极参数对微结构表面电场分布均匀性的影响。根据模拟结果，利用微电铸试验研究了微结构单元尺寸以及辅助极距离和大小对于微结构层厚度均匀性的影响。模拟和试验结果均表明，微结构单元尺寸是影响其均匀性的主要因素之一，合理添加片内辅助极是提高微结构铸层厚度均匀性的有效方法。而且，有限元分析软件ANSYS可以对微结构的电镀过程进行有效的模拟分析。

英文摘要：

The electric field of Ni microelectroforming is simulated by the Finite Element Method Software （ANSYS）. The effect of the thickness of the photoresist, line width and parameter of the auxiliary electrodes on the uniformity of the microstructure is analyzed carefully. Furthermore, the effects of size of the microstructure unit, the distance and size of the auxiliary electrodes on the uniformity of microelectroforming are studied by the electrodeposited experiments according to the simulated results. The simulated and experimental results indicate that size of the microstructure unit is one of the most important factors on the uniformity of microelectroforming. Moreover, the method of adding auxiliary electrodes is an effective way to improve the uniformity of the thickness of the microelectroforming, and FEM is an effective way to simulate the electroforming process.