中文摘要：

建立了微通道热沉的三维数值模型,同时求解流体Navier-Stockes方程、能量方程和固体区域的导热方程,模型计算结果与文献报道实验数据吻合较好.设计了新型的微通道热沉,采用本文模型对其性能进行分析计算.通过在联箱内加入隔板,设计了1—6弯头新型联箱微通道热沉,通过提高每程流速和引入交替顺逆流动,降低微通道热沉的热阻并提高其均温特性,并与直通型和Z型联箱设计比较.在8种联箱设计中,蛇形弯头联箱的热阻和均温特性均优于Z型和直通联箱,即便增大Z型和直通联箱制冷剂供液泵功,其热阻和均温性也很难达到低泵功下蛇形弯头联箱的性能.蛇形弯头数大于4时,底部中心线温度分布曲线基本重合,再增大弯头数,对降低热阻和提高均温性均无明显贡献,同时会增加额外的泵功.

英文摘要：

3D numerical microchannel heat sink model was developed to investigate a heat sink design using a manifold with baffles. The heat sink was modeled by simultaneously solving the Navier-Stokes equations and the energy equation for the liquid domain and the heat conduction equation for solid substrate, with the results agreeing well with reported experimental data. The results show that the serpentine design with 1 to 6 bends increases the flow rate in each tube and induce alternating counter-parallel cross flows significantly, which improve the heat transfer and temperature uniformity in the microchannel heat sink compared with parallel and Z flow type designs for the same pumping power. Both the Z type and parallel manifold designs have difficulty matching the heat transfer rates in the serpentine design for low pumping powers, with very huge pumping powers needed to get the same heat flux. The temperature distribution along the central line at the bottoms for various bends in the serpentine manifold design illustrates that the temperature non-uniformity is not improved by using more than four bends. More power needed to feed the refrigerant into the microchannels with more bends. Thus, there is an optimal number of bends for the serpentine design.