以微波水热法制备的KNN粉体为原料,添加1mol%ZnO、1mol%CuO烧结助剂,采用传统电子陶瓷制备方法.研究了烧结助剂对KNN陶瓷的陶瓷体积密度、显微结构和电性能的影响,结果表明:添加烧结助剂ZnO和CuO可以降低KNN陶瓷的烧结温度,提高KNN陶瓷的体积密度;与此同时,ZnO和CuO添加后降低了KNN无铅压电陶瓷的压电常数d33、介电常数ε33T/ε0,但机械品质因数铱得到很大的提高,介电损耗tanδ明显降低。其中CuO烧结助剂可以使KNN陶瓷的d5,由142pC/N降低至118pC/N,q值由82提高至427,tanδ由2.46%降低至0.64%。
Using KNN powder prepared by microwave-hydrothermal method as raw material, traditional ceramic method was employed to prepare the KNN based lead-free piezoelectric ceramic with 1mol% ZnO or 1mol% CuO sintering additives. The effect of sintering additives on the bulk density, microstructure and electric properties of the ceramic was investigated. The results indicate that ZnO and CuO additives can lower the sintering temperature and enhance the bulk density of KNN ceramic. Furthermore, when ZnO and CuO additives are added, the piezoelectric constant d33 and dielectric constant ε33T/ε0 decrease, but mechanical quality factor Qm greatly increase and dielectric loss tan 5 decrease sharply. In the CuO doped KNN ceramic, the d33 decreases from 142 pC/N to 118 pC/N,Qm increases from 82 to 427,tanδ decreases from 2.46% to 0.64%o