中文摘要：

研究了Cu/Sn-0.7Cu/Cu焊点在蠕变温度为100℃,剪切应力分别为3.62、2.53和1.78 MPa时的蠕变行为。结果表明,3种应力状态下,焊点都呈现出初始蠕变、稳态蠕变和加速蠕变3个典型阶段,并且随着蠕变应力的降低,蠕变寿命延长、稳态阶段的应变速率降低;当蠕变应力较大时,蠕变断裂受位错的滑移、攀移机制控制,而当蠕变应力较小时,蠕变断裂受晶界滑移机制控制;断裂位置位于焊点内部中心。在试验条件下,界面IMC对焊点的蠕变性能没有显著的影响。

英文摘要：

The creep behavior of Cu/Sn-0.7Cu/Cu solder joint was investigated at 100 ℃ with the shearing stress of 3.62 MPa,2.53 MPa and 1.78 MPa,respectively.The results show that all the strain-time creep curves of Cu/Sn-0.7Cu/Cu solder joint include three typical stages,primary creep,secondary creep（steady creep）and tertiary creep.In addition,with the decrease of shearing stress,the creep life is increased and the strain rate is decreased at the steady stage.The creep fracture mechanism is controlled by dislocation sliding and climbing at high stress,while the creep fracture mechanism is controlled by grain boundary sliding at low stress.Also,the fracture location is located in the center of the solder joint,and effects of interface IMC on the creep properties of the solder joint under the experimental condition can be ignored.