中文摘要：

分析微型热敏传感器测量原理并针对其典型器件结构的热平衡模型,提出以微型热敏传感器器件各部分热耗散功率和器件信噪比系数为主要器件结构设计的结构仿真计算目标。然后,结合微型热敏传感器衬底空腔结构对器件性能影响较大的特点,分析计算衬底结构没有空腔、有空气腔和有真空腔3种情况下的器件各部分热耗散功率,验证了有真空腔的衬底结构信噪比系数最高。最后,以实际微细加工工艺条件为基础,计算分析衬底真空腔深度在2μm,4μm和6μm3种条件下的器件信噪比系数,完成对微型热敏传感器器件结构尺寸的优化设计。

英文摘要：

Through the investigations of the measurement method and the thermal balance of the micro thermal sensor device structure,it is improved to use the heat rating of each part of the device and the device signal to noise ratio （SNR） as the emulation and calculation goal to design the dimensions of the structure. Through using ANSYS software analyzing the structure substrate with and without cavity and with vacuum cavity,comparing the calculation result of the heat rating of each part and device SNR in three cases,and analyzing different depths of vacuum cavity in the substrate, the optimization result of the micro thermal sensor device structure dimension is obtained.