中文摘要：

利用JSM6700F冷场发射扫描电镜及其自带的能谱仪等分别对采用镍、镍+铜两种中间层的TC4/ZQSn10-10异种材料扩散连接接头进行了微观分析。结果表明:镍中间层能有效地阻止元素钛与铜之间的扩散,避免产生金属间化合物(Cu3Ti、CuTi等);但在TC4/Ni界面上仍有金属间化合物NiTi、Ni3Ti生成,使接头的抗拉强度有所降低;在适当压力和保温时间、镍为中间层时,较佳连接温度为830℃;镍+铜为中间层时,较佳连接温度为850℃;两者所得接头强度(155.8MPa)相当,均为ZQSn10-10母材强度的65%。

英文摘要：

Effects of different transition metals on the diffusion bonding joints of Ti alloy(TC4) to Tin-bronze(ZQSn10-10) were studied.The microstructure of the diffusion bonding joint was analyzed with SEM,EDS and XRD.The results show that when the interlayer was Ni or Ni+ Cu transition metal,Ni could effectively prevent the diffusion between Ti and Cu and thus avoid producing the Cu-Ti intermetallic compounds(Cu3Ti,CuTi etc.),but the Ni-Ti intermetallic compound(NiTi,Ni3Ti) were formed at the TC4/Ni interface resu...