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圆柱形硅通孔的二维解析电容模型
  • 所属机构名称：清华大学
  • 会议名称：第17届全国计算机辅助设计与图形学学术会议 (获最佳论文奖提名)
  • 时间：2012.7.7
  • 成果类型：会议
  • 相关项目：面向三维芯片的互连参数提取与热分析算法研究
作者： 张青青|喻文健|骆祖莹|
同会议论文项目
面向三维芯片的互连参数提取与热分析算法研究
期刊论文 15 会议论文 13 专利 4
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