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Analytical model of the coupling capacitance between cylindrical through silicon via and horizontal
  • 所属机构名称：清华大学
  • 会议名称：International Conference on ASIC (ASICON)
  • 时间：2013.10.10
  • 成果类型：会议
  • 相关项目：面向三维芯片的互连参数提取与热分析算法研究
作者： Wenjian Yu|Siyu Yang|Qingqing Zhang|
同会议论文项目
面向三维芯片的互连参数提取与热分析算法研究
期刊论文 15 会议论文 13 专利 4
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