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Parallel statistical capacitance extraction of on-chip interconnects with an improved geometric vari
  • 所属机构名称：清华大学
  • 会议名称：2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011
  • 时间：2011.1.1
  • 成果类型：会议
  • 相关项目：面向三维芯片的互连参数提取与热分析算法研究
作者： Yu, Wenjian|Hu, Chao|Zhang, Wangyang|
同会议论文项目
面向三维芯片的互连参数提取与热分析算法研究
期刊论文 15 会议论文 13 专利 4
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