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中文摘要：
Cu-Cr-Zr系合金是一类高强度高导电集成电路用引线框架铜合金。在Gleeble-1500D热模拟实验机上,采用等温压缩实验研究了Cu-Cr-Zr-Ce合金在变形温度为600～800℃、应变速率为0.01～5s-1条件下的流变应力的相互变化规律,测定了其真应力-应变曲线,并利用光学显微镜分析了合金在热压缩过程中的组织演变规律。结果表明,Cu-Cr-Zr-Ce合金的真应力-真应变曲线呈现典型的动态回复特征,其流变应力和峰值应力随变形温度的降低和应变速率的提高而增大;且变形温度越高,应变速率越小,合金越容易发生动态回复和再结晶。在上述实验基础上,基于流变应力、应变速率和温度的相关性,计算出了该合金热压缩变形时的热变形激活能Q,并建立了其等温压缩塑性变形过程的流变应力与变形温度和应变速率之间关系的本构方程。
英文摘要：
Cu-Cr-Zr series copper alloys are usually used as lead frame materials for integrated circuit（IC） with high strength and high electrical conductivity.The flow stress change rules and deformation behavior of the Cu-Cr-Zr-Ce alloy during hot compression deformation were investigated with isothermal compression test method by a Gleeble-1500D thermal-mechanical simulator at elevated temperature.The true stress and true strain curves were measured at the test temperature ranging from 600℃ to 800℃ and the strain rate from 0.01s-1 to 5s-1.The microstructure evolutions of Cu-Cr-Zr-Ce alloy were analyzed with an optical microscope.The results show that the curves of true stress and true strain present characteristics of typical dynamic recovery.The flow stress and the peak flow stress increase with the decrease of deforming temperature and the increase of strain rate.The higher the deforming temperature and the less the strain rate,the easier the dynamic recovery and the dynamic recrystallization taking place.On the basis of the above experimental results,the hot deformation activation energy Q was derived from the correlativity of flow stress,strain rate and temperature,respectively.And the constitutive equation of the Cu-Cr-Zr-Ce alloy was also established,which indicates the relationship among the flow stress,the strain rate and the testing temperature during the isothermal compression plastic deformation.
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