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中文摘要：
采用放电等离子烧结（SPS）工艺制备（Cu/50W）-3%Ti C和Cu/50W两种复合材料,分别对两种复合材料的显微组织、显微硬度、导电率、密度和致密度进行分析和测试。利用Gleeble-1500D热模拟试验机,在温度为550～950℃、应变速率为0.01～1 s-1和总变形量为0.4的条件下,对比研究两种复合材料的高温塑性变形行为和显微组织变化。结果表明：添加少量Ti C的（Cu/50W）-3%Ti C致密度达到98.7%,硬度为113HV0.2,导电率为61.4%IACS;（Cu/50W）-3%Ti C和Cu/50W复合材料的高温流变应力-应变曲线具有典型的动态再结晶特征,峰值应力随变形温度的降低或应变速率的升高而增加。同时,建立了（Cu/50W）-3%Ti C复合材料的高温变形本构方程。
英文摘要：
The （Cu/50W）-3%TiC and Cu/50W composites were prepared by spark plasma sintering （SPS） method. The microstructure, microhardness, electrical conductivity, density and relative density of the two composites were analyzed and measured, respectively. The plastic deformation characteristics at elevated temperature and microstructure changes of the composites were investigated by a Gleeble-1500D thermal simulator at 550-950 ℃, strain rate of 0.01-1 s-1 and total strain of 0.4. The results show that the comprehensive properties of the （Cu/50W）-3%TiC composite with 33%TIC addition are as follows： relative density of 98.7%, mierohardness of 113HV0.2 and electrical conductivity of 61.4%IACS. The true stress-true strain curves of the composites have typical characteristics of dynamic reerystallization. The peak stress increases with the decrease of deformation temperature and the increase of strain rate. The constitutive equations of the （Cu/50W）-3%TiC and Cu/50W composites were established, respectively.
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