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中文摘要：
根据Suhir的双金属带的热应力分布理论，建立了Si／Si直接键合界面应力模型，推导出了由于高温引起的正应力、剪切应力和剥离应力的解析方程。并且应用模拟软件Matlab对热应力进行了模拟，直观地表现了键合界面应力的大小及其分布情况，对键合工艺有一定的指导意义。
英文摘要：
A physical model of the interfacial stresses of Si/Si direct bonding was presented based on the Suhire theory of stresses presented in bimetal strips, and the analytical equations of the normal stresses, the shearing stresses and the peeling stresses were derived according to the stress model. Then, Matlab stress simulation tool was used for the interfical stresses. The simulation results directly show the distribution of the interfacial stresses of Si/Si direct bonding. The results are valuable for bonding process.
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