中文摘要：

以2-甲基咪唑（2MMZ）为芯材,聚苯乙烯（PS）为壁材,采用溶剂挥发技术,制备了一种新型潜伏性2MMZ-PS微胶囊固化剂。通过红外光谱仪（FT-IR）、热重分析仪（TGA）、扫描电子显微镜（SEM）、粒度分析仪和差热扫描量热仪（DSC）对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径约为10.18μm,芯材2MMZ含量为40.36%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶黏剂,具有优良的固化特性和潜伏性能,可在100℃下1h内实现固化,室温储存期可达1个月以上。

英文摘要：

A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole（2MMZ）as core material and polystyrene（PS）as wall material.The chemical structure,core material content,surface morphology,size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR,TGA,SEM,granulometer and DSC.The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 μm,and its core material content was about 40.36%.In addition,the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties.It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100℃ in 1 h and its shelf life at room temperature was more than 1 month.