欢迎您！东篱公司
退出
-
申报数据库
-
立项数据库
-
成果数据库
-
项目获奖数据库
中文摘要：
介绍了微胶囊固化剂的特点及固化机理，对微胶囊固化剂的制备方法及近年来研究进展进行了综述。同时，介绍了微胶囊固化剂在潜伏性预浸料、修复用复合材料以及半导体器件封装材料等领域的应用，并对其前景作了展望。
英文摘要：
The characteristics and curing mechanism of microcapsule curing agent were introduced. The preparation methods and recent research progresses of microcapsule curing agent were summarized. The applications of microcapsule curing agent were also introduced in the latent prepreg, self-healing composites, encapsulation materials for semiconductor devices and other fields. And the future development prospect of microcapsule curing agent was expected.
同期刊论文项目
同项目期刊论文
Preparation and characterization of magnetic composite microspheres using a free radical polymerizat
Effect of particle coverage on morphology of SiO2-covered polymer microspheres by Pickering emulsion
Preparation of magnetic composite microspheres by surfactant free controlled radical polymerization:
位置：