中文摘要：

利用键参数函数理论分析了第三组元Bi或Sn作为Al-Pb非混溶体系实现冶金结合一体化的可行性,并采用液-固包覆成型的方法制得了Al-Bi-Pb及Al-Sn-Pb层状复合材料,通过SEM、EDS等检测手段分析研究试样的显微组织,并讨论了界面的扩散现象。结果表明：第三组元Bi或Sn的引入将Al、Pb的混合焓ΔHmin降低到零以下,在扩散动力学作用驱使下使各元素间在界面处发生了迁移和互扩散,形成了成分调控区,表现为一条状的均质固溶体带,实现了Al与Pb之间的冶金结合。

英文摘要：

The possibility to improve the bonding of Al-Pb interface with taking Bi or Sn as the third element in the interface was analyzed by function of bonding parameters,and the layered composite materials of Al-Bi-Pb and Al-Sn-Pb were prepared by liquid-solid coating method.Microstructure of the layered composite materials were examined by SEM and EDS.The results show that introducing of Bi or Sn reduces the ΔH（min） of Al/Pb system to be negtive,and inter-diffusion of elements in the interface region occurs, and a metallurgical bonding interface between Pb and A1 forms.