LTCC在实现模块/器件轻量化和小型化方面具有优异性能。目前常用生瓷带厚度通常为百微米左右,采用超薄LTCC生瓷带不仅可以实现大容值电容,而且对于进一步缩小组件体积具有重要意义。针对Dupont951-C2超薄层生瓷带(厚度50μm)在基板制造中遇到的若干问题,提出了解决方案,实现了基于超薄LTCC生瓷带的基板制造。
LTCC technology have excellent performance in the realization of lightweight and miniaturization for devices and modules. 120 microns tape is commonly used. Thinner tape can raise the value of capacitor and reduce the volume of devices and modules. Discussed the manufacturing problems of thin tape, and propose manufacturing technology for ultrathin LTCC substrate.