采用恒电流电化学技术直接在金属钼(Mo)或钨(W)片上制备了白钨矿钼酸盐、钨酸盐AMO4(A—Ba、Sr、BaxSr1-x、BaxSryCa1-x-y;M—W、Mo)晶态薄膜,制备时间分别为从薄膜开始生长到薄膜生长结束的不同时间间隔。利用场发射扫描电镜(FESEM)和电子能谱仪(EDX)等测试手段,分别对这些薄膜的生长特性进行了测试,并对测试结果进行了对比分析。结果表明,利用电化学技术制备白钨矿薄膜时,金属基片在不断的溶解;由于负离子配位多面体的沉积、构架和阳离子的不断填充,完成晶核的形成和晶粒的长大;随着时间的增加,光滑饱满的晶粒布满整个基片表面从而完成了薄膜的成膜过程;由于阳离子Ba^2+、Sr^2+、Ca^2+填充速率依次降低,使得在沉积二元和三元薄膜时出现富钡现象。
Molybdate and tungstate AMO4 (where A is Ba^2+ , Sr^2+ , Ca^2+ or the complex of the three ions) films with scheelite-structure were prepared directly on metal M (molybdenum or tungsten) substrates in different time from the early stage to the terminal stage of film growth by using constant current electrochemical technique. The AMO4 films prepared were tested through FESEM and EDX methods, and the results were compared and analyzed. It was found that when the scheelite thin films were being prepared, the dissolving of the substrates, the depositing of W-O4 anion coordination polyhedra, the filling of cations to form the nuclei, and the growth of the crystalline granules were happened resulting in the growth of the films; and finally the crystalline granules bestrew the whole substrate to form the compact films. It was also observed" that the crystalline granules have the characteristics of richbarium phenomena because the filling velocity for the cations of Ba^2+ , Sr^2+ and Ca^2+ decreases gradually.