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A model for squeeze-film damping of perforated MEMS devices in the free molecular regime
  • ISSN号：0960-1317
  • 期刊名称：Journal of Micromechanics and Microengineering
  • 时间：2011.7.7
  • 页码：-
  • 相关项目：扭转式微机械谐振器件的扭转-弯曲耦合热弹性阻尼机理
作者： Pu Li|Rufu Hu|
同期刊论文项目
扭转式微机械谐振器件的扭转-弯曲耦合热弹性阻尼机理
期刊论文 10 会议论文 1 专利 3
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