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Numerical Studies of the Squeeze-film Damping of MEMS Devices with Perforations in the Non-continuum
  • 期刊名称：Advanced Materials Research
  • 时间：2013.6.6
  • 页码：130-135
  • 相关项目：扭转式微机械谐振器件的扭转-弯曲耦合热弹性阻尼机理
作者： Feng Yu|Pu Li|Zhuo Wang|
同期刊论文项目
扭转式微机械谐振器件的扭转-弯曲耦合热弹性阻尼机理
期刊论文 10 会议论文 1 专利 3
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