中文摘要：

伴随着三维集成电路的迅速发展,三维片上网络受到国内外研究者的广泛关注.三维片上网络主要用于实现三维堆叠芯片的互连通信,为三维集成电路提供超低的延迟和竖直方向上超高的带宽,从而解决系统集成度增加导致的通信瓶颈问题,有利于克服存储墙问题并提高三维堆叠芯片的性能.文章介绍了三维集成电路研究现状及其结构优势,分析三维片上网络体系结构的特点和存在的问题,包括竖直方向的单跳传播问题、路由器交叉开关的复杂度控制问题以及热效应的控制问题,从系统层、微结构层和电路层对三维片上网络体系结构的研究热点及其实例进行了深入分析,最后对三维片上网络所面临的挑战和设计方法进行了总结和展望.

英文摘要：

3D integrated circuit, stacked multiple silicon layers vertically, can significantly reduce latency and energy consumption. With the development of the 3D integrated circuit, 3D Networks-on-Chip （NoCs） has widely received attention from researchers all over the world. The 3D NoC is used for interconnection among 3D stacking chips. It provides ultra low latency and ultra high bandwidth for the 3D integrated circuit through vertical direction. It can address the bottleneck of communication caused by the increasing of system integration, then the problem of memory wall can also be addressed. It will largely improve the performance of 3D stacked chips.This article first reviews the current research progress and advantages in 3D structure, analyzes features and challenges of 3D NoC, including single-hop transferring problem through vertical direction, the complexity control of router crossbar and the heat control problem, and then introduces research hotspots of 3D NoC from the system layer, microarchitecture layer and circuit layer, including the introduction and analyses of examples. These research hotspots are extended from 3 basic NoC portions, including topology, routing algorithm and router microarchitecture. Finally, some open issues and future directions in 3D NoC are discussed.