介绍了一种新型微机械隧道振动陀螺仪的设计和工艺制备,该陀螺仪采用平行梳齿驱动和面外振动框架的方式分别作为质量块的振动和恒隧道电流的检测,对平行梳齿驱动的工作原理和隧道陀螺仪的设计进行了详细的阐述.由于采用了硅玻键合和DRIE的DDSOG体硅制备工艺,因而可以获得较大的敏感质量块,从而使得该陀螺仪具有较高的灵敏度.根据检测模态和驱动模态匹配的原则,利用有限元模型对隧道陀螺仪的结构尺寸进行了优化.仿真结果表明,该陀螺仪在常压下具有0.07nm(*/s)的灵敏度.
A bulk mieromachined vibratory tunneling gyroscope, which is fabricated with silicon-glass wafer bonding and DRIE (deep reactive ion etching) , has been developed. The device structure consists of a proof mass which can oscillate due to electrostatic comb driving and an out-of-plane silicon frame linked up to substrate by suspended springs. Because of adopting the silicon frame structure to get larger proof mass and putting tunneling tip at the end of silicon frame to obtain remarkable deformation induced by Coriolis force, the new ultracompact devices can provide extremely high sensitivity and wide dynamic range. Based on the modal analysis of gyroscope by FEM method,the structure dimensions are optimized according to resonant frequency matching of driving mode and detection mode. Simulation results demonstrate that the gyroscope owns the sensitivity of 0.07 nm(*/s) at atmospheric pressure. The deep dry silicon on glass (DDSOG) process has been successfully used to fabricate this bulk tunneling gyroscope.