介绍了InGaN紫外探测器的研制过程,并给出了器件的性能。利用金属有机化学气相沉积(MOCVD)方法生长GaN外延材料,通过刻蚀、钝化、欧姆接触电极等工艺,制作了正照射单元In0.09Ga0.91N紫外探测芯片。并对该芯片进行了I-V特性、响应光谱等测试,得到芯片的暗电流Id为1.00×10-12 A,零偏压电阻R0为1.20×109Ω。该紫外探测器在360~390nm范围内有较高的响应度,峰值响应率在378nm波长处达到0.15A/W,在考虑表面反射时,内量子效率达到60%;优质因子R0A为3.4×106Ω·cm2,对应的探测率D*=2.18×1012 cm·Hz1/2·W-1。
The fabrication and characterization of InGaN ultraviolet photodetector were reported in this work. GaN multilayers were grown with metal-organic chemical vapor deposition (MOCVD). Material etching, passivation, metal contact and other techniques were used in the manufacture of unit front-illuminated InGaN detector. The current-voltage (Ⅰ-Ⅴ) curve shows that the current and resistance at zero bias is 1.00 × 10-12 A and 1.20 × 109 Ω, respectively. A flat band spectral response is achieved in the 360 ~ 390 nm. The detector displays an unbiased response of 0.15 A/W at 378 nm, corresponding to an internal quantum efficiency of 60%. The RoA values up to 3.4 ~ 106 Ω · cmz are obtained corresponding to D* = 2.18 × 1012 cm · Hz1/2 · W-1.