中文摘要：

以Si3N4粉末作为增强组元与颗粒状聚苯乙烯进行复合，用热模压法制备了氮化硅／聚苯乙烯复合电子基板材料。研究了Si3N4含量和聚苯乙烯颗粒大小对复合材料导热性能和介电性能的影响，通过理论分析确定了影响导热性能的主要因素。研究结果表明，随Si3N4含量的增加，复合材料中粉末形成导热网络，复合材料的热导率也随之增加，聚苯乙烯颗粒尺寸越大，复合材料热导率越大。热导率的增加与导热网络的形成有关，增加Si3N4含量和聚苯乙烯颗粒尺寸都有助于导热网络的形成。复合材料的介电常数取决于复合材料体系组元的体积含量。

英文摘要：

A kind of composite substrate was fabricated using Si3N4powder as filler and polystyrene （PS） particles as matrix employing the method of heat press molding. The effect of volume fraction of Si3N4and particle size of the matrix on the thermal conductivity of the composite was investigated; the dielectric constant of the composite was evaluated. The main factors that affect the thermal conductivity of the composite were confirmed through theoretically analyzing. Experimental results show that with the filler content increasing, a thermally conductive network is formed in the composite, thus thermal conductivity of the composite increases rapidly, the composite experiences higher thermal conductivity with larger PS particles. The increasing of thermal conductivity is dominated by the ease of forming a thermal conductive network. PS with larger particle size and Si3N4 in higher content have better effect on forming a conductive network. The dielectric constant is determined by the content of the composition.