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Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomec
  • ISSN号：0925-8388
  • 期刊名称：Journal of Alloys and Compounds
  • 时间：0
  • 页码：32-35
  • 相关项目：单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
作者： Chen, Hongtao|Li, Jue|Li, Mingyu|
同期刊论文项目
单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
期刊论文 8
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