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Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects und
  • ISSN号：0167-9317
  • 期刊名称：Microelectronic Engineering
  • 时间：0
  • 页码：82-91
  • 相关项目：单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
作者： Chen, Hongtao|Wang, Ling|Han, Jing|Li, Mingyu|Liu, Hao|
同期刊论文项目
单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
期刊论文 8
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