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Grain orientation evolution and deformation behaviors in Pb-free solder interconnects under mechanic
  • 期刊名称：Journal of Electronic Materials
  • 时间：0
  • 页码：2445-2457
  • 相关项目：单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
作者： 陈宏涛|
同期刊论文项目
单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制
期刊论文 8
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基于晶粒取向的无铅互连焊点可靠性研究
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