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Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

ISSN号：1005-0302
期刊名称：Journal of Materials Science & Technology
时间：0
页码：-
分类：TN405[电子电信—微电子学与固体电子学] TU411.7[建筑科学—岩土工程;建筑科学—土工工程]
作者机构：[1]Department of Materials Science and Engineering, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, China, [2]State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China
相关基金：Acknowledgments The work was financially supported by the National Natural Science Foundation of China under Grant No. 50905042, the Shenzhen Special Funds for Overseas High-level Talents （No. KQC201109020053A）, Shenzhen Technological Innovation Project （No. CXZZ20120829103358067） and the Shenzhen Special Funds for Strategic Emerging Industries （No. JCYJ20120613140542764）.
相关项目：单晶或极少晶粒构成的无铅互连焊点局部再结晶弱化和损伤机制

作者：陈宏涛|

关键词：剪切试验, 变形行为, 无铅焊接, 样品, 动态再结晶, 扫描电子显微镜, 电子背散射衍射, 显微组织, Shear test, Deformation behavior, Lead-free solder, Electron backscattered diffraction, Dynamic recrystallization, Microhardness

中文摘要：

Corresponding author. Prof, State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China. Tel.：＋86 755 26033463; Fax：＋86 755 26033462; E-mail address： myli@hit.edu.cn （M. Li）.

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