中文摘要：

为改善高能量密度电子设备的冷却效率，提出了在微流道热沉内填充金属泡沫的新型热沉结构，并数值研究了金属泡沫的孔隙率、孔密度、材质（铜、镍及铝）、流体工质（水、乙二醇及纳米流体）等相关参数对微流道流动与换热特性的影响．研究结果表明：金属泡沫可以显著地强化微流道热沉的换热特性；添加金属泡沫后微流道热沉的换热性能可提高2倍以上；采用纳米流体与金属泡沫相结合的双重强化换热手段可以进一步地增强微流道热沉的冷却能力：在层流流动状态下金属泡沫微流道热沉可以对发热量为200W／cm2的电子设备进行有效地冷却，表明其在高功率密度电子设备热管理领域具有广阔的应用前景．

英文摘要：

A novel structure of metal-foam filled microchannel heat sink was proposed for elec- tronics cooling applications. Effects of the main parameters, such as porosity, pore density, metal foam materials （copper, nickel and aluminum） and coolants （water, ethylene glycol and nanofluid）, were numerically studied to predict the pressure drop and heat transfer perform- ance of laminar flow in the heat sink. The results show that the thermal performance of the mi- crochannel heat sink is enhanced over twice after filling-in of metal foam, and it is also positive for the heat transfer efficiency to employ nanofluid as coolant. The results also show that the microchannel heat sink filled with metal foam is well qualified for cooling chips with heat flux of 200 W/cm2, which means that it has great potential for thermal management of electronics de- vices with high power density.